Standard Specifications For CANON PLA-501
(Common to PLA-501 FA and 501 F ( S )

	Photo mask size	3”; 4”; 5”, 6”  Mask  	Dimensions
	Wafer size	2”, 3”, 4” 5” 	Body	940mm (W) × 800mm (D) × 724mm (H)
		[SEMi used as standard]		(37.0" x 31.5" x 28.5")
	Illuminator		Body on special	1100mm (W) × 820mm (D) × 1344mm (H)
	Uniformity	--+3%	table	(43.3" × 32.3" x 52.9")
	Exposure time	Timer	Control box	300mm (W) × 710mm (D) x 487mm (H)
	setting			(11.8"x 28.0" x 19.2 ")
	Printing time	2 seconds for nega-resist (OMR-83)	Weight
		5 seconds for posi-resist (AZ-1350)	PLA-501 FA on	225 kg (496 lbs.)
	Alignment scope		special table
			PLA-501 F on	210 kg (462 lbs.)
	Objective lens	× 10	special table
	Eyepiece	x 1 O, x 15	Control box	30 kg (66 lbs.)
	Field of observation	Split image	Utility
	Scanning range	XY scanning by left hand
			Power	Main body: AC 110v, 240v
		X and Y directions: +/- 8mm each		Power supply box: 800VA or more
	Alignment method		High pressure air	3.5 kg/cms (49.8 p.s.i.) or more
	[In case of PLA-501 FA] 	Auto alignment	Low pressure air	2.5 kg/cms (35.6 p.s.i.) or more
	Tolerance setting	-+0.5, -+1.0, -+2.0/~m	(clean air)
	Alignment time	Approx. 10 sec.
			N2gas	1 kg/cms (1 4.2 p.s.i.) or more
	Alignment pattern	Key patterns for auto alignment
			Vacuum	45 cm--76 cm Hg (17.7"--29.9" Hg)
	Offset control	READ and WRITE possible (0--7.9/~m, in
		0.1/~m units, 0--79/~m, in 1/~m units)	STANDARD COMPOSITION
	Observation dur-	Possible	1. Main body (PLA-501 FA or 501 F) 	1
	lng auto alignment
			2. Illuminator 	1
	Alignment mode	Three modes of auto, semi-auto and manual	3. Alignment scope 	1
	possible	4. Objective lens x 10 	1 pair
[In case of PLA-501 FA and 501 F] 	Manual alignment	5. Eyepiece × 10, × 15 	1 pair each
	XY adjustment	By means of the wafer XY alignment grip	6. Photo mask holder 7") 	1
		Coarse: 4:1, Fine: 100:1,
			7. Wafer chuck  	1
		Maximum travel of (;b 10 (501F), (~7 (501 FA)	8. Calibrator 	1
	e adjustment	By means of the wafer e control switches	9. Auto feeder  	1 set
		Changeable between coarse and fine	10. Control box 	1
		Travel of -+5° with self-centering mecha-	11. Mercury lamp power supply box 	1
		nism	12. Special table 	1
	Photo mask e	The photo mask is also relatable -+5° by	13. Tools	1 set
	adjustment	knob operation ......................................
			14. Filter ND-50, ND-25, L-39 ( not included ) 	1 each
	Printing method	Proximity and contact modes selectable
	Alignment gap	0/~m to 98/~m	15. Level 	1

	Proximity gap	0p, m to 48/~m	(In case of PLA-501 FA, FA unit is attached separately.)

	Contact printing	Vacuum contact method                                                OPTIONAL EQUIPMENT
		Contact pressure changeable from	1. Objective lens x5, ×20
		10cmHg to user-supplied vacuum pressure.	
	Auto feeder	Possible to change between auto and	2. Wafer chuck
	manual feed	3. Calibrator	Various sizes (SEMI used as standard)
	Carrier	GCA or Teflon carrier with pitch of 3/16", 25	4. Auto feeder
		wafer capacity	5. Gap measuring equipment
	Drive method	Belt and air bearing drive	6. Extension board
	Realignment	(bO.1 mm
	accuracy		7. UC filter
		8.Illuminatorfor UV, DPUV or Near UV, 
Cycling time (index)	Approx. 30 sec. (with alignment time 10 sec.
	and exposure time 1 sec.)	Power: 250w, 500w, 1000w or 1500w